Categories: News

GIGABYTE Unveils X870E AERO X3D WOOD at CES 2026 – Redefining High-Performance Motherboards with Natural Elegance

LOS ANGELES, Jan. 19, 2026 /PRNewswire/ — GIGABYTE TECHNOLOGY Co. Ltd, a leading global manufacturer of motherboards, graphics cards, and hardware solutions, today unveiled the X870E AERO X3D WOOD at CES 2026. This new category of premium motherboards blends high-performance engineering with lifestyle-focused design.

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As PCs increasingly move into open living and working spaces, X870E AERO X3D WOOD reimagines hardware as a design statement, bringing warmth and sophistication to high-end builds without compromising capability.

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A New Aesthetic for a New Era of PC Design
Inspired by natural materials and modern interiors, the X870E AERO X3D WOOD reflects a shift toward design-driven hardware. The motherboard features wood-inspired accents and a premium leather pull tab, delivering a tactile and visual experience rarely seen in traditional PC components.

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Designed for enthusiasts, creators, and gamers who value both form and function, X870E AERO X3D WOOD integrates naturally into lifestyle-focused PC setups, transforming hardware into a centerpiece rather than something to hide away. 

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Flagship Performance Powered by AMD X3D
Beneath its refined exterior, X870E AERO X3D WOOD delivers uncompromising performance. Built on the AMD Socket AM5 platform, it supports the latest Ryzen™ 9000, 8000, and 7000 Series processors and enhances X3D performance through AI-assisted X3D Turbo Mode 2.0.

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The motherboard supports DDR5 memory overclocking up to 9000MT/s and features a robust digital twin 16+2+2 phases VRM design for stable and efficient power delivery. Expansion capabilities include dual PCIe 5.0 slots for graphics cards and four M.2 slots supporting PCIe 5.0 / 4.0 x4 for ultra-fast storage.

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Advanced Thermal Engineering with Elegant Integration
To maintain peak performance, X870E AERO X3D WOOD features a comprehensive thermal solution engineered for both efficiency and visual aesthetics.

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Key thermal innovations include: 

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  • VRM Thermal Armor Advanced with high-efficiency heat pipes
  • M.2 Thermal Guard L & M.2 Thermal Guard Ext.
  • PCB Thermal Plate, improving thermal performance by 14% and adding structural stability. 

Next-Generation Connectivity and User-Friendly Features
Equipped with dual 5GbE LAN, Wi-Fi 7, and dual USB4 Type-C ports (DisplayPort Alt Mode/HDMI), the board includes GIGABYTE’s user-centric innovations: 

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  • DriverBIOS with pre-installed Wi-Fi drivers for instant network access
  • M.2 EZ-Flex with a flexible patented baseplate for improved SSD cooling
  • WIFI EZ-Plug for simplified antenna installation
  • M.2 EZ-Latch Click & Plus for tool-free SSD installation 

For more information, please visit: 
Official Website: https://www.gigabyte.com/Motherboard/X870E-AERO-X3D-WOOD
Order Here: GIGABYTE X870E AERO X3D WOOD

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Photo – https://mma.prnewswire.com/media/2863436/CES_Wood_MB_PR_Article_Edit_3_1_6_1.jpg

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View original content:https://www.prnewswire.co.uk/news-releases/gigabyte-unveils-x870e-aero-x3d-wood-at-ces-2026—redefining-high-performance-motherboards-with-natural-elegance-302664279.html

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